SBC

제목[SBC(PICMG1.3)] PCIE-96522021-04-21 16:25:35
카테고리SBC(PICMG1.3)
작성자

Features
 

1. Supports mobile Merom core 65 nm Intel® Core™2 Duo processors with
an 800MHz FSB
2. Two 240-pin 2 GB (max.) 667 MHz or 533 MHz dual-channel DDR2
SDRAM DIMM supported (system max. 4GB)
3. Supports analog CRT, 18/24-bit dual-Channel LVDS and HDTV output
4. Dual Intel® PCIe GbE controllers
5. Three 3.0 Gbps SATA II connectors with RAID function support

Specifications 

CPUSocket P Intel® Core™2 Duo, Core™ Duo, Core™ Solo and Celeron® M Mobile processors with a 533 MHz or 800 MHz FSB
System ChipsetIntel® GME965 + ICH8M-E
BIOSAMI BIOS
System MemoryTwo 240-pin 2 GB (max.) 667 MHz or 533 MHz dual-channel DDR2 SDRAM DIMM supported (system max. 4GB)
EthernetDual Intel® 82573L PCIe GbE controllers
I/O Interface2 x RS-232
1 x LPT
1 x FDD
2 x 5-pin wafer on board for KB/MS
3 x SATA II with RAID 0, 1
1 x IDE
10 x USB 2.0 (Two on bracket, four on-board and four on backplane )
1 x TPM
Super I/ON/A
Digital I/O8-bit digital I/O (4-bit input, 4-bit output)
Infrared1 x Infrared
Audio10-pin on-board header connects to the IEI AC-KIT883HD 7.1 channel HD Audio kit
SSDCF Type II
Display InterfacesTV-out
(NTSC/PAL and Max. 1080i HDTV Resolultion via Component output)
18/24-bit dual-channel LVDS
Analog CRT
ExpansionN/A
Watchdog TimerSofware Programmable support 1~255 sec. System reset
Power SupplyATX
Power Consumption3.3 V @ 0.13 A, 5 V @ 5.3 A, 5 Vsb @ 0.04 A, 12 V @ 1.3 A running
3DMark® 2001 with a 2 GHz Intel® Core™2 Duo T7300 processor and 1 GB of 667 MHz DDR2 SDRAM
Temperature0ºC ~ 60ºC (32ºF ~ 140ºF)
Humidity5%~95% non-condension
Dimension338 mm x 126 mm
Weight1.1 kg



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